COM Express: Lead the Small Form Factor Board Race

Abstract

Year-end 2010 proved to be quite a successful year reflecting a growth of 120% over 2009 reaching over $130 million as shown in the revenue graph below.

If one assumes typical module prices in volume of $500 to $1,000, this corresponds to 130,000 to 260,000 modules shipped. The large number of applications for COM Express and their significant volumes (often in the thousands or tens of thousands) indicates that such growth should continue for several years.

COM Express modules typically contain memory, Ethernet, PCI Express, USB, and storage (SATA) interfaces, monitor, graphics, and audio interfaces, and other circuitry on a double credit card sized board that can fit in a tiny space. COM Express’ advantages include an open standard, small footprint, easy upgrading, and extensive on-board I/O capabilities. It can easily handle a variety of processors with varying performance, power consumption, and cost. It allows designers to reduce time-to-market, lower costs, and simplify revisions, maintenance, and upgrades. The idea here is to isolate standard functions (the COM module) from application-dependent ones (a carrier module) and allow designers to focus on aspects that are product-differentiating and where they have special expertise.

The history of Computer-on-Modules in the ultra-small form factor category is at the same time the success story of the PICMG COM Express standard. Starting from the basic version, which was introduced into the market in 2004, it was possible to maintain the specifications set by the standard but still keep up with the pace of constant product miniaturization. The compact and ultra form factors have substantially smaller dimensions, but the system developer nevertheless finds all the pins in their COM Express-compatible position.

This standardization is a considerable simplification for developers, because it means they can populate their applications with the latest chip technology without having to redesign every time round. That applies worldwide because the specifications standardized by the PICMG industrial consortium are established globally. Companies such as, Cisco Systems, Fujitsu, IBM, Intel, NEC, Nokia Siemens Networks, NTT, Kontron, and Oracle along with many others all participate in these standardization measures.

With the early adoption of new technologies, all parties benefit from mutual experience, resulting in technically mature solutions. For OEMs and developers this means that they already have access to the latest Intel® technologies at board and system level, reducing their time-to-market for latest solutions.

The prime benefit of the COM Express-designed modules is its suitability for use in extreme operating environments. Plus, the module has no moving parts; even the memory is firmly soldered on. Another attractive feature of the module is that it is fanless and does not require ventilators – a possible source of failures - for smooth operation in extreme conditions.

Table of Contents

List of Tables

List of Figures

COM Express

COM Express Version 2.0

Embedded Boards and Modules

Methodology

Market Environments and Trends

COM Express Market Segment Growth

OM Express Growth Drivers

Benefits of COM Express

Target Market Segments

Retails

Medical

Test and Measurements

Military and Government

Security

Industrial and Process Control

Gaming Entertainment Platforms

Five-Year Forecast 2011 - 2015

Major Player Profiles