Crystal Cube Consulting

Crystal Cube Consulting

 

 

 

 

 

 

AdvancedTCA

NCOIC

SCOPE

Advanced Mezzanine Cards

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Abstract

The existing and continued successful implementation of Advanced Telecommunications Computing Architecture (ATCA) will definitely be augmented by the Advanced Mezzanine Card (AMC) design. Currently underway, the completion of the AMC standards AMC.0 through AMC.3 is right on schedule, with light scale rollout of AMC modules around mid-year 2005. In 2006, Crystal Cube Consulting (CCC) projects a significant full-scale rollout of AMC modules. The graph below reflects the initial growth compared to ATCA. Ultimately we see AMC’s growth equivalent to 20% to 30% of the ATCA market. It certainly appears on the surface that AMC will definitely trump the previous generation of CompactPCI and VME solutions taking ATCA to new levels.

amc revenue chartimg9.gif

The hot swappability feature for AMC is without question a very compelling tool. CompactPCI and ATCA support a hot swappable capability at the board level, however, until just recently hot swappable support for mezzanine cards did not exist. AMC's hot swappability possesses the ability to significantly reduce operating costs by providing carriers with the ability to upgrade, provision, and service working systems in the field with minimal disruption to overall system operation. This capability will go along way in reducing operating expenses, in the field, for the carriers. Certainly this same “Hot Swap” capability will be an exciting addition to the ATCA platforms for the enterprise market as well.

The real success of the ATCA platforms and AMC module design is based on the PICMG standards groups insisting on telecommunications as the central focus. ATCA platforms with its salient features, such as, high bandwidth, hot swappability, integrated system management, and high power capability make it the ideal baseline telecom platform. The AMC module expands upon those features to provide individual field replaceable modules, with programmability, providing tremendous flexibility to service personnel. As mentioned previously the OPEX savings to the carriers will be substantial.

The industry has now reached a point where the carriers, and enterprise markets, need low-cost, flexible networks to deliver all the new leading edge features customers are demanding. The Telcos must be capable and ready to design and implement quickly all of the advanced voice and data services customers are looking for. To be successful, TEMs and carriers must move away from the proprietary systems, utilizing custom designs and rapidly move to the ATCA platforms augmented with AMC modules. Finally ATCA is a standard that is quickly experiencing tremendous acceptance in the market as it addresses the requirements of the TEMs and carriers.

The telecommunications industry is beginning to embrace this new economic reality, utilizing AMC modules to augment ATCA platforms, which will drive growth, both in revenue and profitability.

This groundbreaking AMC report from Crystal Cube Consulting (CCC) will provide:

  • A window to the future applications for AMC enabled hardware used in ATCA Platforms.
  • Technical Overview of Advanced Mezzanine Cards
  • Profiles of the Major TEMs, Chip Providers, and AMC module Suppliers.
  • Where do we go from here? What’s up with MicroTCA and Cubes?
  • Five-year forecast including year-end 2004 and forecasting from 2005 – 2009.
  • Revenue growth and unit shipments for:
    • DSPs
    • General Purpose Processors
    • I/O devices
    • Mass Storage
    • Network Processor Units and Storage Devices

This AMC report is the first report to cover the revenue and unit shipments activity of AMC modules, which is expected to generate in excess of 13 billion by year-end 2009.

Table of Contents

Executive Summary

Methodology

Advanced Mezzanine Card (AMC) Technical Overview

Special Interest Groups and Standards Groups

AMC Five-Year Forecast 2004 - 2009

  • AMC Revenue & Shipments forecast totals
  • Digital Signal Processors (DSPs) 2004 - 2009
  • General Purpose Processors 2004 - 2009
  • Mass Storage 2004 - 2009
  • Network Processor Units (NPUs) 2004 - 2009
  • I/O Devices 2004 - 2009

The Next Few Years – AMC and MicroTCA

Appendix A Vendors

Major Telecommunications Network Manufacturers (TEMs)

  • Alcatel
  • Avaya
  • Ericsson
  • Fujitsu
  • Huawei Technologies LTD
  • Lucent
  • Nortel Networks
  • Siemens

Major Chip Companies

  • Agere
  • Freescale
  • IDT
  • Intel
  • Lattice Semiconductor
  • ON Semiconductor
  • Potentia Semiconductor
  • Tera Chips
  • Texas Instruments
  • Vitesse
  • XiLinx

Major Suppliers

  • Adlinktech
  • Adtron
  • Advant
  • Advantech
  • Artesyn Technologies
  • Continuous Computing
  • Elma Electronics
  • EMC Corporation
  • Ericsson
  • FCI Connectors
  • Flextronics
  • Fortinet
  • Forte Design and Development
  • Foxconn Electronics
  • Fulcrum Microsystems
  • GE Fanuc
  • GNP Corporation
  • Harting
  • Hewlett Packard
  • Hybricom Corporation
  • Interphase
  • IP Unity
  • Isxratel
  • Kontron
  • Linear
  • Marconi
  • Mercury Computer Systems
  • Meritec
  • Molex
  • Momentum Computer Embedded Processing
  • Motorola
  • Nallatech
  • Netapp
  • Netinsight
  • Nokia
  • NMS Communications
  • Osa Technologies
  • Pentair
  • Performance Technologies
  • Piegon Point Systems
  • PLX Technologies
  • Quantum3D
  • Radisys
  • Radiatron
  • Redback Networks, Inc.
  • Samsung
  • Samtec
  • Sanmina SCI
  • SBS Technologies
  • Schroff
  • SynQor
  • Spectrumsignal
  • StarGen
  • Summitmicro
  • Sun
  • Tekelectronics
  • Tekmicro
  • Telesoft Technologies
  • Tracewell
  • Teradiant
  • Tyco Electronics
  • Ultacom
  • UTStarcom
  • Vmetro
  • Zynx Networks
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